Invention Grant
US08652878B2 Stress-engineered interconnect packages with activator-assisted molds
有权
具有活化剂辅助模具的应力设计互连封装
- Patent Title: Stress-engineered interconnect packages with activator-assisted molds
- Patent Title (中): 具有活化剂辅助模具的应力设计互连封装
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Application No.: US13799168Application Date: 2013-03-13
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Publication No.: US08652878B2Publication Date: 2014-02-18
- Inventor: Christopher L. Chua , Bowen Cheng , Eugene M. Chow , Dirk De Bruyker
- Applicant: Palo Alto Research Center Incorporated
- Applicant Address: US CA Palo Alto
- Assignee: Palo Alto Research Center Incorporated
- Current Assignee: Palo Alto Research Center Incorporated
- Current Assignee Address: US CA Palo Alto
- Agency: Marger Johnson & McCollom, PC
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
A method includes providing a pad chip having contact pads, providing a spring chip having micro-springs, applying a chemical activator to one of either the pad chip or the spring chip, applying an adhesive responsive to the chemical activator on the other of the pad chip or the spring chip, aligning the pad chip to the spring chip such that the micro-springs will contact the contact pads, and pressing the pad chip and the spring chip together such that the chemical activator at least partially cures the adhesive.
Public/Granted literature
- US20130196471A1 STRESS-ENGINEERED INTERCONNECT PACKAGES WITH ACTIVATOR-ASSISTED MOLDS Public/Granted day:2013-08-01
Information query
IPC分类:
