Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US13175332Application Date: 2011-07-01
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Publication No.: US08652911B2Publication Date: 2014-02-18
- Inventor: Kee-In Bang , Tae-Jung Lee , Myoung-Kyu Park
- Applicant: Kee-In Bang , Tae-Jung Lee , Myoung-Kyu Park
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2010-0064353 20100705
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L21/762

Abstract:
A method of fabricating a semiconductor device includes forming a device isolation region on a semiconductor substrate to define an active region, forming a gate electrode on the active region and the device isolation region across the active region, and forming at least one gate electrode opening portion in the gate electrode so as to overlap an edge portion of the active region, wherein the gate electrode opening portion is simultaneously formed with the gate electrode.
Public/Granted literature
- US20120003805A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2012-01-05
Information query
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