Invention Grant
- Patent Title: Method of manufacturing a semiconductor device
- Patent Title (中): 制造半导体器件的方法
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Application No.: US13240883Application Date: 2011-09-22
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Publication No.: US08652928B2Publication Date: 2014-02-18
- Inventor: Young-Bae Yoon , Jeong-Dong Choe , Dong-Hoon Jang , Ki-Hyun Kim
- Applicant: Young-Bae Yoon , Jeong-Dong Choe , Dong-Hoon Jang , Ki-Hyun Kim
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR2008-0023062 20080312
- Main IPC: H01L21/76
- IPC: H01L21/76

Abstract:
A semiconductor device includes a substrate having a first area and a second area, a first transistor in the first area, a second transistor in the second area, an isolation layer between the first area and the second area, and at least one buried shield structure on the isolation layer.
Public/Granted literature
- US20120015496A1 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE Public/Granted day:2012-01-19
Information query
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