Invention Grant
- Patent Title: Method for decomposing thermoset resin and recovering decomposition product
- Patent Title (中): 分解热固性树脂并回收分解产物的方法
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Application No.: US12934390Application Date: 2009-03-26
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Publication No.: US08653150B2Publication Date: 2014-02-18
- Inventor: Takumi Izumitani , Takaharu Nakagawa , Masaru Hidaka , Keishi Shibata , Junko Matsui
- Applicant: Takumi Izumitani , Takaharu Nakagawa , Masaru Hidaka , Keishi Shibata , Junko Matsui
- Applicant Address: JP Osaka JP Mie
- Assignee: Panasonic Corporation,International Center for Environmental Technology Transfer
- Current Assignee: Panasonic Corporation,International Center for Environmental Technology Transfer
- Current Assignee Address: JP Osaka JP Mie
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2008-081962 20080326; JP2008-114481 20080424
- International Application: PCT/JP2009/056129 WO 20090326
- International Announcement: WO2009/119742 WO 20091001
- Main IPC: C08J11/04
- IPC: C08J11/04

Abstract:
The present invention relates to a method for decomposing, in the presence of subcritical water, a thermosetting resin comprising a polyester moiety and a crosslinking moiety therewith to provide a compound comprising an acid residue derived from the polyester moiety and a residue derived from the crosslinking moiety, and collecting the compound in an efficient yield, specifically, which comprises steps of: (I) decomposing the thermosetting resin in the presence of subcritical water to provide a solid comprising a compound comprising an acid residue derived from the polyester moiety and a residue derived from the crosslinking moiety, (II) subjecting the solid to an organic solvent to dissolve the compound into the organic solvent, wherein the organic solvent has a higher solubility which can dissolve the compound than that of water, and (III) collecting, separating or isolating the compound from the organic solvent.
Public/Granted literature
- US20110086930A1 METHOD FOR DECOMPOSING THERMOSET RESIN AND RECOVERING DECOMPOSITION PRODUCT Public/Granted day:2011-04-14
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