Invention Grant
US08653202B2 Adhesive composition for semiconductor, semiconductor device making use of the same and process for producing semiconductor device
有权
用于半导体的粘合剂组合物，使用其的半导体器件和用于制造半导体器件的方法
- Patent Title: Adhesive composition for semiconductor, semiconductor device making use of the same and process for producing semiconductor device
- Patent Title (中): 用于半导体的粘合剂组合物，使用其的半导体器件和用于制造半导体器件的方法
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Application No.: US11921560Application Date: 2006-06-05
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Publication No.: US08653202B2Publication Date: 2014-02-18
- Inventor: Koichi Fujimaru , Toshihisa Nonaka
- Applicant: Koichi Fujimaru , Toshihisa Nonaka
- Applicant Address: JP Tokyo
- Assignee: TORAY Industries, Inc.
- Current Assignee: TORAY Industries, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Kubovcik & Kubovcik
- Priority: JP2005-165287 20050606
- International Application: PCT/JP2006/311184 WO 20060605
- International Announcement: WO2006/132165 WO 20061214
- Main IPC: C08G69/26
- IPC: C08G69/26 ; C08F8/00 ; C08L63/00 ; C08L61/04 ; C08L69/00 ; C08F283/04 ; C08G69/48 ; C08G73/10 ; C08L77/00 ; C08L79/08
Abstract:
An adhesive composition for semiconductor containing an organic-solvent-soluble polyimide (a), an epoxy compound (b) and a hardening accelerator (c), wherein per 100 wt parts of the epoxy compound (b), there are contained 15 to 90 wt parts of the organic-solvent-soluble polyimide (a) and 0.1 to 10 wt parts of the hardening accelerator (c), wherein the epoxy compound (b) contains a compound being liquid at 25° C. under 1.013×105 N/m2 and a compound being solid at 25° C. under 1.013×105 N/m2, and wherein a ratio of compound being liquid based on all the epoxy compounds is 20 wt % or more and 60 wt % or less.
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