Invention Grant
- Patent Title: Wiring board comprising wirings arranged with crest and trough
- Patent Title (中): 接线板包括布置有波峰和波谷的布线
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Application No.: US13328351Application Date: 2011-12-16
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Publication No.: US08653381B2Publication Date: 2014-02-18
- Inventor: Tetsuya Hiraoka
- Applicant: Tetsuya Hiraoka
- Applicant Address: JP Yokohama
- Assignee: Fujitsu Semiconductor Limited
- Current Assignee: Fujitsu Semiconductor Limited
- Current Assignee Address: JP Yokohama
- Agency: Fujitsu Patent Center
- Priority: JP2011-063152 20110322
- Main IPC: H05K1/16
- IPC: H05K1/16

Abstract:
A wiring board includes: a first wiring; a second wiring being disposed adjacently to the first wiring; a third wiring being disposed adjacently to the first wiring; a fourth wiring being disposed adjacently to the third wiring; and an insulating layer, wherein the second wiring and the fourth wiring are disposed adjacently to each other, the first wiring and the fourth wiring are not overlapped, the second wiring and the third wiring are not overlapped, a crest and a trough are provided on a side face of the first wiring, the crest and the trough are provided on a side face of the second wiring, the trough provided on the side face of the first wiring and the third wiring are overlapped, and the trough provided on the side face of the second wiring and the fourth wiring are overlapped.
Public/Granted literature
- US20120241197A1 WIRING BOARD Public/Granted day:2012-09-27
Information query