Invention Grant
- Patent Title: Memory cells
- Patent Title (中): 记忆单元
-
Application No.: US13556956Application Date: 2012-07-24
-
Publication No.: US08653496B2Publication Date: 2014-02-18
- Inventor: Jun Liu
- Applicant: Jun Liu
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H01L45/00
- IPC: H01L45/00

Abstract:
Some embodiments include a memory cell that contains programmable material sandwiched between first and second electrodes. The memory cell can further include a heating element which is directly against one of the electrodes and directly against the programmable material. The heating element can have a thickness in a range of from about 2 nanometers to about 30 nanometers, and can be more electrically resistive than the electrodes. Some embodiments include methods of forming memory cells that include heating elements directly between electrodes and programmable materials.
Public/Granted literature
- US20120286229A1 Memory Cells Public/Granted day:2012-11-15
Information query
IPC分类: