Invention Grant
- Patent Title: Semiconductor device with sidewall insulating layer
- Patent Title (中): 具有侧壁绝缘层的半导体器件
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Application No.: US13029146Application Date: 2011-02-17
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Publication No.: US08653513B2Publication Date: 2014-02-18
- Inventor: Hideomi Suzawa , Shinya Sasagawa , Motomu Kurata
- Applicant: Hideomi Suzawa , Shinya Sasagawa , Motomu Kurata
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2010-043137 20100226
- Main IPC: H01L29/78
- IPC: H01L29/78

Abstract:
A semiconductor device includes an oxide semiconductor layer, a source electrode and a drain electrode in contact with the oxide semiconductor layer, a gate electrode overlapping with the oxide semiconductor layer, and a gate insulating layer between the oxide semiconductor layer and the gate electrode, in which the source electrode or the drain electrode comprises a first conductive layer and a second conductive layer having a region which extends beyond an end portion of the first conductive layer in a channel length direction and which overlaps with part of the gate electrode, in which a sidewall insulating layer is provided over the extended region of the second conductive layer, and in which the sidewall insulating layer comprises a stack of a plurality of different material layers.
Public/Granted literature
- US20110210326A1 SEMICONDUCTOR DEVICE Public/Granted day:2011-09-01
Information query
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