Invention Grant
- Patent Title: Thin-film transistor forming substrate, semiconductor device, and electric apparatus
- Patent Title (中): 薄膜晶体管形成基板,半导体器件和电气设备
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Application No.: US13304766Application Date: 2011-11-28
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Publication No.: US08653523B2Publication Date: 2014-02-18
- Inventor: Takashi Sato
- Applicant: Takashi Sato
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: ALG Intellectual Property, LLC
- Priority: JP2010-268713 20101201
- Main IPC: H01L29/786
- IPC: H01L29/786

Abstract:
There is provided a thin-film transistor forming substrate in which at least one of a source electrode, a drain electrode, and a gate electrode, which are constituent elements of a thin film transistor, or a first electrode is included on a face of a substrate main body that is located on any one side in a thickness direction. An embedded wiring that is connected to one of the source electrode, the drain electrode, the gate electrode, and the first electrode is buried inside the substrate main body.
Public/Granted literature
- US20120138940A1 THIN-FILM TRANSISTOR FORMING SUBSTRATE, SEMICONDUCTOR DEVICE, AND ELECTRIC APPARATUS Public/Granted day:2012-06-07
Information query
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