Invention Grant
- Patent Title: Back side illumination type solid state imaging device and method of manufacturing the same
- Patent Title (中): 背面照明型固态成像装置及其制造方法
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Application No.: US13235405Application Date: 2011-09-18
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Publication No.: US08653620B2Publication Date: 2014-02-18
- Inventor: Maki Sato
- Applicant: Maki Sato
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2010-273315 20101208
- Main IPC: H01L31/00
- IPC: H01L31/00

Abstract:
According to one embodiment, an imaging device includes a semiconductor substrate having a first conductivity type, a well region which is arranged on a front surface side of the semiconductor substrate and has the first conductivity type, photodiodes which are arranged in the well region and have a second conductivity type, a diffusion layer which is arranged between the photodiodes, supplies a potential to the well region, and has the first conductivity type, an overflow drain layer which is arranged on a back surface side of the semiconductor substrate and has the second conductivity type, an overflow drain electrode which extends from the front surface side of the semiconductor substrate to the overflow drain layer and supplies a bias potential to the overflow drain layer from the front surface side of the semiconductor substrate, and a wiring layer which is arranged on the front surface of the semiconductor substrate.
Public/Granted literature
- US20120146116A1 BACK SIDE ILLUMINATION TYPE SOLID STATE IMAGING DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2012-06-14
Information query
IPC分类: