Invention Grant
US08653625B2 Interposer structure with embedded capacitor structure, and methods of making same
有权
具有嵌入式电容器结构的内插器结构及其制造方法
- Patent Title: Interposer structure with embedded capacitor structure, and methods of making same
- Patent Title (中): 具有嵌入式电容器结构的内插器结构及其制造方法
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Application No.: US11685816Application Date: 2007-03-14
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Publication No.: US08653625B2Publication Date: 2014-02-18
- Inventor: Chong Chin Hui , David J. Corisis , Choon Kuan Lee
- Applicant: Chong Chin Hui , David J. Corisis , Choon Kuan Lee
- Applicant Address: US ID Boise
- Assignee: MicronTechnology, Inc.
- Current Assignee: MicronTechnology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H01L29/00
- IPC: H01L29/00
Abstract:
A device is disclosed which includes an interposer, at least one capacitor formed at least partially within an opening formed in the interposer and an integrated circuit that is operatively coupled to the interposer. A method is disclosed which includes obtaining an interposer having at least one capacitor formed at least partially within an opening in the interposer and operatively coupling an integrated circuit to the interposer. A method is also disclosed which includes obtaining an interposer comprising a dielectric material, forming an opening in the interposer and forming a capacitor that is positioned at least partially within the opening.
Public/Granted literature
- US20080224292A1 INTERPOSER STRUCTURE WITH EMBEDDED CAPACITOR STRUCTURE, AND METHODS OF MAKING SAME Public/Granted day:2008-09-18
Information query
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