Invention Grant
- Patent Title: Package structures including a capacitor and methods of forming the same
- Patent Title (中): 封装结构包括电容器及其形成方法
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Application No.: US13551676Application Date: 2012-07-18
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Publication No.: US08653626B2Publication Date: 2014-02-18
- Inventor: Sut-I Lo , Ching-Wen Hsiao , Hsu-Hsien Chen , Chen-Shien Chen
- Applicant: Sut-I Lo , Ching-Wen Hsiao , Hsu-Hsien Chen , Chen-Shien Chen
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L21/00
Abstract:
A package includes a die, an encapsulant, and a capacitor. The package has a package first side and a package second side. The die has a die first side corresponding to the package first side, and has a die second side corresponding to the package second side. The die first side is opposite the die second side. The encapsulant surrounds the die. The capacitor includes a first plate and a second plate in the encapsulant, and opposing surfaces of the first plate and the second plate extend in a direction from the package first side to the package second side. The external conductive connectors are attached to at least one of the package first side and the package second side.
Public/Granted literature
- US20140021583A1 PACKAGE STRUCTURES INCLUDING A CAPACITOR AND METHODS OF FORMING THE SAME Public/Granted day:2014-01-23
Information query
IPC分类:
