Invention Grant
- Patent Title: Bipolar semiconductor device and manufacturing method thereof
- Patent Title (中): 双极半导体器件及其制造方法
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Application No.: US13887935Application Date: 2013-05-06
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Publication No.: US08653627B2Publication Date: 2014-02-18
- Inventor: Ken-ichi Nonaka
- Applicant: Honda Motor Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Honda Motor Co., Ltd.
- Current Assignee: Honda Motor Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2005-172620 20050613
- Main IPC: H01L21/331
- IPC: H01L21/331

Abstract:
A semiconductor crystal having a recombination-inhibiting semiconductor layer of a second conductive type that is disposed in the vicinity of the surface between a base contact region and emitter regions and that separates the semiconductor surface having a large number of surface states from the portion that primarily conducts the positive hole electric current and the electron current. Recombination is inhibited, and the current amplification factor is thereby improved and the ON voltage reduced.
Public/Granted literature
- US20130240910A1 BIPOLAR SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2013-09-19
Information query
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