Invention Grant
- Patent Title: Semiconductor device with acene heat spreader
- Patent Title (中): 带有乙烯散热器的半导体器件
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Application No.: US12805834Application Date: 2010-08-20
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Publication No.: US08653650B2Publication Date: 2014-02-18
- Inventor: Tomio Iwasaki
- Applicant: Tomio Iwasaki
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2009-199189 20090831
- Main IPC: H01L23/14
- IPC: H01L23/14
Abstract:
A semiconductor device in which an adhesion between a lead and a sealing body (mold sealing body) is improved to prevent the peering is provided. In a semiconductor device having a semiconductor chip, a plurality of leads electrically connected to the semiconductor chip and mainly made of metal and a sealing body for sealing the semiconductor chip, in order to improve the adhesion between the lead and the sealing body (mold sealing body), a material combination with good lattice matching is used as a combination of a surface material of the lead and a material of the sealing body, and the sealing body mainly made of acene is used.
Public/Granted literature
- US20110049689A1 SEMICONDUCTOR DEVICE WITH ACENE HEAT SPREADER Public/Granted day:2011-03-03
Information query
IPC分类:
