Invention Grant
- Patent Title: Package including at least one topological feature on an encapsulant material to resist out-of-plane deformation
- Patent Title (中): 封装包括在封装材料上的至少一个拓扑特征以抵抗面外变形
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Application No.: US12628042Application Date: 2009-11-30
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Publication No.: US08653675B2Publication Date: 2014-02-18
- Inventor: James Jian Zhang , Jason Brand , Jacob Brooksby , Dejen Eshete , Myung Jin Yim , Ravikumar Adimula , Dan Graves
- Applicant: James Jian Zhang , Jason Brand , Jacob Brooksby , Dejen Eshete , Myung Jin Yim , Ravikumar Adimula , Dan Graves
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H01L23/28
- IPC: H01L23/28 ; H01L23/29
Abstract:
Embodiments include but are not limited to apparatuses and systems including semiconductor packages, e.g. memory packages, including a die and an encapsulant material formed over the die, and at least one topological feature formed on an external surface of the encapsulant material, and configured to resist out-of-plane deformation of the package. Other embodiments may be described and claimed.
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