Invention Grant
- Patent Title: Pattern generating apparatus and pattern shape evaluating apparatus
- Patent Title (中): 图案生成装置和图案形状评价装置
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Application No.: US13959384Application Date: 2013-08-05
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Publication No.: US08655050B2Publication Date: 2014-02-18
- Inventor: Yasutaka Toyoda , Hideo Sakai , Ryoichi Matsuoka
- Applicant: Hitachi High-Technologies Corporation
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: McDermott Will & Emery LLP
- Priority: JP2008-031314 20080213
- Main IPC: G06K9/00
- IPC: G06K9/00

Abstract:
Although there has been a method for evaluating pattern shapes of electronic devices by using, as a reference pattern, design data or a non-defective pattern, the conventional method has a problem that the pattern shape cannot be evaluated with high accuracy because of the difficulty in defining an exact shape suitable for the manufacturing conditions of the electronic devices. The present invention provides a shape evaluation method for circuit patterns of electronic devices, the method including a means for generating contour distribution data of at least two circuit patterns from contour data sets on the circuit patterns; a means for generating a reference pattern used for the pattern shape evaluation, from the contour distribution data; and a means for evaluating the pattern shape by comparing each evaluation target pattern with the reference pattern.
Public/Granted literature
- US20130315468A1 PATTERN GENERATING APPARATUS AND PATTERN SHAPE EVALUATING APPARATUS Public/Granted day:2013-11-28
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