Invention Grant
US08655449B2 Modular cochlear implant systems including implantable sound processors
有权
模块化耳蜗植入系统,包括可植入声音处理器
- Patent Title: Modular cochlear implant systems including implantable sound processors
- Patent Title (中): 模块化耳蜗植入系统,包括可植入声音处理器
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Application No.: US12696275Application Date: 2010-01-29
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Publication No.: US08655449B2Publication Date: 2014-02-18
- Inventor: Matthew I. Haller , Leonid M. Litvak , Abhijit Kulkarni
- Applicant: Matthew I. Haller , Leonid M. Litvak , Abhijit Kulkarni
- Applicant Address: CH Zug
- Assignee: Advanced Bionics AG
- Current Assignee: Advanced Bionics AG
- Current Assignee Address: CH Zug
- Agency: ALG Intellectual Property, LLC
- Main IPC: A61N1/372
- IPC: A61N1/372 ; A61N1/378 ; A61N1/36

Abstract:
Exemplary cochlear implant systems include an implantable head module configured to be implanted within a head of a patient. The implantable head module includes a cochlear stimulator configured to be coupled to an electrode lead, the electrode lead including one or more electrodes configured to be in communication with one or more stimulation sites within the patient. The implantable head module also includes a signal receiver configured to receive a telemetry signal representative of an audio signal from a signal transmitter located external to the patient, a sound processor configured to process the telemetry signal and direct the cochlear stimulator to generate and apply electrical stimulation representative of the audio signal to the one or more stimulation sites via the electrode lead, and a power receiver configured to receive power for operating the implantable head module from a power transmitter located external to the patient.
Public/Granted literature
- US20100198303A1 MODULAR COCHLEAR IMPLANT SYSTEMS INCLUDING IMPLANTABLE SOUND PROCESSORS Public/Granted day:2010-08-05
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