Invention Grant
- Patent Title: Connector and semiconductor test device
- Patent Title (中): 连接器和半导体测试装置
-
Application No.: US13557347Application Date: 2012-07-25
-
Publication No.: US08657625B2Publication Date: 2014-02-25
- Inventor: Hirotaka Wagata , Shin Sakiyama , Hiroyuki Hama , Teruhito Suzuki , Hiroyuki Yajima , Akinori Mizumura
- Applicant: Hirotaka Wagata , Shin Sakiyama , Hiroyuki Hama , Teruhito Suzuki , Hiroyuki Yajima , Akinori Mizumura
- Applicant Address: JP Yamato JP Tokyo
- Assignee: Molex Japan Co., Ltd.,Advantest Corporation
- Current Assignee: Molex Japan Co., Ltd.,Advantest Corporation
- Current Assignee Address: JP Yamato JP Tokyo
- Agent Timothy M. Morella
- Priority: JP2011-162278 20110725
- Main IPC: H01R9/05
- IPC: H01R9/05

Abstract:
A connector includes a signal terminal, an insulating member, a ground terminal and an enclosure. The signal terminal has a main body extending in one direction, and a contact arm provided on each side of the main body for contacting another conductor. The insulating member encloses the main body. The ground terminal has a cylindrical main body enclosing the insulating member, and a contact arm provided on each side of the cylindrical main body for contacting another conductor. The cylindrical main body includes first and second semi-cylindrical parts, each having semi cylindrical shapes. The semi-cylindrical parts make a cylindrical shape as a whole by both end parts of the circumferential direction being assembled so as to mutually overlap. An insertion hole is formed in the enclosure where an assembly of the signal element, the insulating member and the ground terminal are inserted.
Public/Granted literature
- US20130189866A1 CONNECTOR AND SEMICONDUCTOR TEST DEVICE Public/Granted day:2013-07-25
Information query