Invention Grant
- Patent Title: Printed circuit board assembly sheet and method for manufacturing the same
- Patent Title (中): 印刷电路板组装片及其制造方法
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Application No.: US13189612Application Date: 2011-07-25
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Publication No.: US08658906B2Publication Date: 2014-02-25
- Inventor: Jun Ishii , Terukazu Ihara , Naohiro Terada
- Applicant: Jun Ishii , Terukazu Ihara , Naohiro Terada
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Panitch Schwarze Belisario & Nadel LLP
- Priority: JP2010-177632 20100806
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K7/10
Abstract:
A dummy trace portion is provided in a region between at least a suspension board with circuit on one end side and a support frame of a suspension board assembly sheet with circuits. A base insulating layer is formed on a support substrate in the dummy trace portion. A plurality of conductor traces are formed on the base insulating layer, and a cover insulating layer is formed on the base insulating layer to cover each conductor trace. At least one of the base insulating layer and the cover insulating layer in the dummy trace portion has a groove.
Public/Granted literature
- US20120033395A1 PRINTED CIRCUIT BOARD ASSEMBLY SHEET AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2012-02-09
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