Invention Grant
US08659095B2 Semiconductor memory device and method of manufacturing the same 有权
半导体存储器件及其制造方法

  • Patent Title: Semiconductor memory device and method of manufacturing the same
  • Patent Title (中): 半导体存储器件及其制造方法
  • Application No.: US13563189
    Application Date: 2012-07-31
  • Publication No.: US08659095B2
    Publication Date: 2014-02-25
  • Inventor: Tae Gyun Kim
  • Applicant: Tae Gyun Kim
  • Applicant Address: KR Gyeonggi-do
  • Assignee: SK Hynix Inc.
  • Current Assignee: SK Hynix Inc.
  • Current Assignee Address: KR Gyeonggi-do
  • Agency: IP & T Group LLP
  • Priority: KR10-2011-0081287 20110816
  • Main IPC: H01L21/336
  • IPC: H01L21/336
Semiconductor memory device and method of manufacturing the same
Abstract:
A semiconductor device includes a semiconductor substrate including a first driving transistor region having a first driving transistor disposed therein and a second driving transistor region having a second driving transistor disposed therein, wherein the second driving transistor is driven at a lower voltage than the first driving transistor, a first gate insulating layer formed at edges of the second driving transistor region, and a second gate insulating layer formed at a center of the second driving transistor region, wherein the first gate insulating layer is thicker than the second gate insulating layer.
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