Invention Grant
- Patent Title: Method for manufacturing a micromechanical structure, and micromechanical structure
- Patent Title (中): 微机械结构的制造方法和微机械结构
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Application No.: US13586576Application Date: 2012-08-15
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Publication No.: US08659099B2Publication Date: 2014-02-25
- Inventor: Jochen Reinmuth , Heribert Weber
- Applicant: Jochen Reinmuth , Heribert Weber
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Kenyon & Kenyon LLP
- Priority: DE102011080978 20110816
- Main IPC: H01L29/84
- IPC: H01L29/84

Abstract:
A method for manufacturing a micromechanical structure includes: forming a first insulation layer above a substrate; forming a first micromechanical functional layer on the first insulation layer; forming multiple first trenches in the first micromechanical functional layer, which trenches extend as far as the first insulation layer; forming a second insulation layer on the first micromechanical functional layer, which second insulation layer fills up the first trenches; forming etch accesses in the second insulation layer, which etch accesses locally expose the first micromechanical functional layer; and etching the first micromechanical functional layer through the etch accesses, the filled first trenches and the first insulation layer acting as an etch stop.
Public/Granted literature
- US20130043548A1 METHOD FOR MANUFACTURING A MICROMECHANICAL STRUCTURE, AND MICROMECHANICAL STRUCTURE Public/Granted day:2013-02-21
Information query
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