Invention Grant
- Patent Title: Electronic components on trenched substrates and method of forming same
- Patent Title (中): 沟槽基片上的电子元件及其形成方法
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Application No.: US12783787Application Date: 2010-05-20
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Publication No.: US08659119B2Publication Date: 2014-02-25
- Inventor: Vijayeshwar D. Kharma , Jennifer V. Muncy , Arun Sharma , Sri M. Sri-Jayantha , Lorenzo Valdevit , David Questad
- Applicant: Vijayeshwar D. Kharma , Jennifer V. Muncy , Arun Sharma , Sri M. Sri-Jayantha , Lorenzo Valdevit , David Questad
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: McGinn IP Law Group, PLLC
- Agent Vazken Alexanian
- Main IPC: H01L27/01
- IPC: H01L27/01
Abstract:
An electronic module including a substrate having at least one structure that reduces stress flow through the substrate, wherein the structure comprises at least one trench in a surface of the substrate.
Public/Granted literature
- US20100276784A1 ELECTRONIC COMPONENTS ON TRENCHED SUBSTRATES AND METHOD OF FORMING SAME Public/Granted day:2010-11-04
Information query
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