Invention Grant
- Patent Title: Metal pad structures in dies
- Patent Title (中): 模具中的金属垫结构
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Application No.: US13247616Application Date: 2011-09-28
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Publication No.: US08659123B2Publication Date: 2014-02-25
- Inventor: Yao-Chun Chuang , Chita Chuang , Chen-Cheng Kuo , Chen-Shien Chen
- Applicant: Yao-Chun Chuang , Chita Chuang , Chen-Cheng Kuo , Chen-Shien Chen
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L23/58
- IPC: H01L23/58
Abstract:
A die includes a substrate, a metal pad over the substrate, and a passivation layer that has a portion over the metal pad. A dummy pattern is disposed adjacent to the metal pad. The dummy pattern is level with, and is formed of a same material as, the metal pad. The dummy pattern forms at least a partial ring surrounding at least a third of the metal pad.
Public/Granted literature
- US20130075872A1 Metal Pad Structures in Dies Public/Granted day:2013-03-28
Information query
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