Invention Grant
- Patent Title: High frequency characteristic measuring device
- Patent Title (中): 高频特性测量装置
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Application No.: US13324382Application Date: 2011-12-13
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Publication No.: US08659304B2Publication Date: 2014-02-25
- Inventor: Shin Chaki
- Applicant: Shin Chaki
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: JP2011-111075 20110518
- Main IPC: G01R27/02
- IPC: G01R27/02

Abstract:
A high frequency characteristic measuring device for measuring high frequency characteristics of a high frequency device to be measured by contacting probe needles with the high frequency device to be measured, before mounting of the high frequency device to be measured. The high frequency characteristic measuring device includes an input matching circuit substrate with an input matching circuit thereon, a first coaxial connector electrically connected to the input matching circuit substrate, and first probe needles electrically connected to the input matching circuit substrate. The high frequency characteristic measuring device further includes an output matching circuit substrate with an output matching circuit thereon, a second coaxial connector electrically connected to the output matching circuit substrate, and second probe needles electrically connected to the output matching circuit substrate.
Public/Granted literature
- US20120293184A1 HIGH FREQUENCY CHARACTERISTIC MEASURING DEVICE Public/Granted day:2012-11-22
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