A solid state disk assembly includes a solid state disk, a first heat conducting member and a second heat conducting member. The solid state disk includes a printed circuit board (PCB) and a chipset. The PCB includes a front surface, a rear surface, a first end, and a second end. The chipset is mounted on the front surface. The first heat conducting member abuts the chipset for absorbing heat generated by the solid state disk and includes at least a pair of elastic arms. The second heat conducting member attaches on the rear surface and includes at least a pair of engaging arms spatially corresponding to the at least one pair of elastic arms. The first end and the second end are clamped between the at least one pair of elastic arms. Each elastic arm engages with a respective one of the engaging arms.