Seamless headsets and related systems and methods of manufacture are provided. In this regard, a representative headset includes: an earpiece assembly having a ribbon cable portion and an earpiece portion; the ribbon cable portion having a body and multiple elongated conductors, the body being formed of electrically insulating material; the earpiece portion extending from a distal end of the body, the earpiece portion being configured as a contiguous extension of the insulating material of the body such that the earpiece assembly exhibits a seamless transition from the ribbon cable portion to the earpiece portion.