Invention Grant
- Patent Title: Structurally integrated antenna aperture electronics attachment design and methodology
- Patent Title (中): 结构集成天线孔电子附件设计和方法
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Application No.: US12910825Application Date: 2010-10-24
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Publication No.: US08661649B1Publication Date: 2014-03-04
- Inventor: Manny S. Urcia , Joseph A. Marshall , Douglas A. McCarville , Otis F. Layton , Adrian Viisoreanu
- Applicant: Manny S. Urcia , Joseph A. Marshall , Douglas A. McCarville , Otis F. Layton , Adrian Viisoreanu
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Ameh IP
- Agent Lowell Campbell; Elahe Toosi
- Main IPC: H01S4/00
- IPC: H01S4/00
Abstract:
A method of manufacture of antenna electronics attachment is disclosed. A nutplate is coupled to a mounting plate via a plurality of embedded fastening structures such that mechanical-electronic coupling means allow in-service change-out of an electronic component coupled to the nutplate.
Information query
