Invention Grant
US08661655B2 Method suitable for transferring a component supported by a carrier to a desired position on a substrate, and a device designed for this
有权
适用于将由载体支撑的部件转移到基板上的期望位置的方法，以及为此设计的装置
- Patent Title: Method suitable for transferring a component supported by a carrier to a desired position on a substrate, and a device designed for this
- Patent Title (中): 适用于将由载体支撑的部件转移到基板上的期望位置的方法，以及为此设计的装置
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Application No.: US10515470Application Date: 2003-05-08
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Publication No.: US08661655B2Publication Date: 2014-03-04
- Inventor: Johannus Wilhelmus Weekamp , Marc Andre De Samber , Johan Bosman , Willem Hoving , Renatus Hendricus Maria Sanders
- Applicant: Johannus Wilhelmus Weekamp , Marc Andre De Samber , Johan Bosman , Willem Hoving , Renatus Hendricus Maria Sanders
- Applicant Address: NL Eindhoven
- Assignee: Koninklijke Philips N.V.
- Current Assignee: Koninklijke Philips N.V.
- Current Assignee Address: NL Eindhoven
- Priority: EP02077043 20020524
- International Application: PCT/IB03/01909 WO 20030508
- International Announcement: WO03/101171 WO 20031204
- Main IPC: H05K3/30
- IPC: H05K3/30 ; H05K3/32
Abstract:
A method for transferring an electronic component supported by a carrier to a desired position on a substrate include moving the carrier supporting the component relative to the substrate while the component is present on a side of the carrier facing towards the substrate, with the component is positioned opposite the desired position on the substrate. Then, a light beam is directed at the carrier, at the location of the component, from a side remote from the substrate, as a result of which a connection between the component and the carrier is broken and the component is transferred from the carrier to the substrate.
Public/Granted literature
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