Invention Grant
- Patent Title: Process for the production of a circuit portion on a substrate
- Patent Title (中): 在基板上制造电路部分的方法
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Application No.: US12305839Application Date: 2007-06-21
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Publication No.: US08661661B2Publication Date: 2014-03-04
- Inventor: Axel Ahnert , Elmar Grandy
- Applicant: Axel Ahnert , Elmar Grandy
- Agency: Sughrue Mion, PLLC
- Priority: DE102006028536 20060621
- International Application: PCT/EP2007/005489 WO 20070621
- International Announcement: WO2007/147602 WO 20071227
- Main IPC: H05K3/02
- IPC: H05K3/02 ; H05K3/10 ; H01K3/00

Abstract:
The invention relates to a method for producing at least one circuit part on a substrate (20). Said method comprises the following steps: at least one granulate (54), which contains an electric conductor and which has a predefined geometric distribution, is deposited on the substrate (20) and the granulate (54) is heated and forms a permanent connection with the substrate (20) and forms at least one circuit part on the substrate (20). The invention also relates to a circuit board comprising at least one substrate, on which at least one circuit part is arranged, and to a device for producing at least one circuit part on a substrate (20).
Public/Granted literature
- US20090205204A1 PROCESS FOR THE PRODUCTION OF A CIRCUIT PORTION ON A SUBSTRATE Public/Granted day:2009-08-20
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