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US08661661B2 Process for the production of a circuit portion on a substrate 失效
在基板上制造电路部分的方法

  • Patent Title: Process for the production of a circuit portion on a substrate
  • Patent Title (中): 在基板上制造电路部分的方法
  • Application No.: US12305839
    Application Date: 2007-06-21
  • Publication No.: US08661661B2
    Publication Date: 2014-03-04
  • Inventor: Axel AhnertElmar Grandy
  • Applicant: Axel AhnertElmar Grandy
  • Agency: Sughrue Mion, PLLC
  • Priority: DE102006028536 20060621
  • International Application: PCT/EP2007/005489 WO 20070621
  • International Announcement: WO2007/147602 WO 20071227
  • Main IPC: H05K3/02
  • IPC: H05K3/02 H05K3/10 H01K3/00
Process for the production of a circuit portion on a substrate
Abstract:
The invention relates to a method for producing at least one circuit part on a substrate (20). Said method comprises the following steps: at least one granulate (54), which contains an electric conductor and which has a predefined geometric distribution, is deposited on the substrate (20) and the granulate (54) is heated and forms a permanent connection with the substrate (20) and forms at least one circuit part on the substrate (20). The invention also relates to a circuit board comprising at least one substrate, on which at least one circuit part is arranged, and to a device for producing at least one circuit part on a substrate (20).
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