Invention Grant
- Patent Title: Cutting devices
- Patent Title (中): 切割装置
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Application No.: US13687632Application Date: 2012-11-28
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Publication No.: US08661957B2Publication Date: 2014-03-04
- Inventor: Syuji Aoyama , Toshiyuki Kani , Shinya Kojima , Goh Yamamura , Katsuhiko Sasaki
- Applicant: Makita Corporation
- Applicant Address: JP Anjo-shi
- Assignee: Makita Corporation
- Current Assignee: Makita Corporation
- Current Assignee Address: JP Anjo-shi
- Agency: Oliff PLC
- Priority: JP2008-001179 20080108; JP2008-003262 20080110; JP2008-212790 20080821; JP2008-300889 20081126
- Main IPC: B27B27/06
- IPC: B27B27/06

Abstract:
A cutting device includes a table for placing thereon a workpiece. A tool unit supports a cutting tool and is laterally tiltably supported on the table, so that the rotational axis of the cutting tool can be inclined relative to a horizontal direction. A positioning device includes a first positioning member and a second positioning member that can interact with each other to position the tool unit at a plurality of laterally tilted positions. At least one of the first and second positioning members can be moved to change the laterally tilted position positionable by the positioning device.
Public/Granted literature
- US20130087034A1 CUTTING DEVICES Public/Granted day:2013-04-11
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