Invention Grant
- Patent Title: Multi-layered sound attenuation mechanism
- Patent Title (中): 多层声衰减机制
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Application No.: US13395943Application Date: 2010-06-25
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Publication No.: US08662249B2Publication Date: 2014-03-04
- Inventor: Prashant Unnikrishnan Nair , Nitin Vaidya
- Applicant: Prashant Unnikrishnan Nair , Nitin Vaidya
- Applicant Address: US TX Sugar Land
- Assignee: Schlumberger Technology Corporation
- Current Assignee: Schlumberger Technology Corporation
- Current Assignee Address: US TX Sugar Land
- Agent Michael Flynn; Timothy Curington; Robin Nava
- International Application: PCT/IB2010/052928 WO 20100625
- International Announcement: WO2011/036575 WO 20110331
- Main IPC: E04B1/82
- IPC: E04B1/82

Abstract:
A sound attenuation mechanism made up of multiple substrate layers, including corrugated layers. The use of corrugation provides an inexpensive and manner of forming a plurality of highly effective acoustic attenuation channels throughout the mechanism. The multi-layered mechanism may be provided in a variety of modular forms and sizes which may be combined to form a low-cost, highly effective attenuation housing. For example, such a housing may be utilized to contain otherwise noisy large scale oilfield equipment such as coiled tubing engines. Additionally, where drainage from the housing is sought, a spiraled attenuation channel may be employed such that the effectiveness of the attenuation provided by the housing is not sacrificed.
Public/Granted literature
- US20130048417A1 Multi-Layered Sound Attenuation Mechanism Public/Granted day:2013-02-28
Information query
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