A wireless IC device includes a cutout portion having no aluminum-deposited film that is provided at an end of an article package made of an aluminum-deposited laminated film, and an electromagnetic coupling module is provided at the cutout portion. The electromagnetic coupling module and the aluminum-deposited film of the package define a wireless IC device. A loop electrode, which is a magnetic field transmission auxiliary radiator of the electromagnetic coupling module, is coupled to the aluminum-deposited film of the package. Thus, the article package functions as a radiator of an antenna.