Invention Grant
- Patent Title: Light module
- Patent Title (中): 灯模块
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Application No.: US13209525Application Date: 2011-08-15
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Publication No.: US08662728B2Publication Date: 2014-03-04
- Inventor: Tsai-Yi Chiu , Ping Lee , Cheng-Min Tsai
- Applicant: Tsai-Yi Chiu , Ping Lee , Cheng-Min Tsai
- Applicant Address: TW Hsin-Chu
- Assignee: AU Optronics Corporation
- Current Assignee: AU Optronics Corporation
- Current Assignee Address: TW Hsin-Chu
- Agency: McClure, Qualey & Rodack, LLP
- Priority: TW99134323A 20101008
- Main IPC: F21V7/04
- IPC: F21V7/04

Abstract:
A light module is disclosed. The light module includes a first printed circuit board, a second printed circuit board, a light source, and a fixing casing, wherein the first printed circuit board and the second printed circuit board each has a fixing part, and the fixing part of the second printed board is attached to the fixing part of the first printed board. The light source is disposed on the first printed circuit board to couple to the first printed board and the second printed board. The fixing casing has a contact surface. When the fixing casing is fixed onto the fixing parts of the second printed circuit board and the first printed circuit board, the contact surface contacts the fixing part so that the second printed circuit board is clamped between the contact surface and the first printed circuit board.
Public/Granted literature
- US20120087140A1 Light Module Public/Granted day:2012-04-12
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