Invention Grant
- Patent Title: Wafer level optics
- Patent Title (中): 晶圆级光学元件
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Application No.: US13089076Application Date: 2011-04-18
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Publication No.: US08662765B2Publication Date: 2014-03-04
- Inventor: Pavel Reshidko , Kai Engelhardt , Ephraim Goldenberg , Michael Dror
- Applicant: Pavel Reshidko , Kai Engelhardt , Ephraim Goldenberg , Michael Dror
- Applicant Address: US CA San Jose
- Assignee: DigitalOptics Corporation
- Current Assignee: DigitalOptics Corporation
- Current Assignee Address: US CA San Jose
- Agency: Turocy & Watson, LLP
- Main IPC: G03B17/00
- IPC: G03B17/00 ; G02B13/18 ; G02B9/08

Abstract:
Providing for a wafer level optical system employing composite lenses is disclosed herein. Conventional focus lens assemblies require three or more lenses. By way of example, two composite lenses can be used to reduce the cost of a wafer-level camera. In some aspects, the composite lenses can be aspheric and can employ a broader variety of wafer materials than earlier designs that only operated in narrow ranges of refractive indices and Abbe numbers.
Public/Granted literature
- US20110255856A1 WAFER LEVEL OPTICS Public/Granted day:2011-10-20
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