Invention Grant
- Patent Title: Substrate processing apparatus
- Patent Title (中): 基板加工装置
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Application No.: US12917638Application Date: 2010-11-02
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Publication No.: US08662811B2Publication Date: 2014-03-04
- Inventor: Junya Minamida , Issei Ueda
- Applicant: Junya Minamida , Issei Ueda
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JP2009-252973 20091104; JP2010-180538 20100811
- Main IPC: H01L21/677
- IPC: H01L21/677

Abstract:
Manufacturing cost or energy consumption of a substrate processing apparatus can be reduced. The substrate processing apparatus includes a substrate loading/unloading unit (a substrate transit chamber 12) that transfers a substrate 2 accommodated in a carrier 3; a substrate transfer chamber 14 (25) communicating with the substrate loading/unloading unit via a substrate loading/unloading port 37 (39); a plurality of substrate processing chambers 15 to 24 (26 to 35) arranged along the substrate transfer chamber 14 (25); a substrate transfer device 36 (38) provided in the substrate transfer chamber 14 (25) and configured to transfer the substrate 2 between the substrate loading/unloading unit and the substrate processing chambers 15 to 24 (26 to 35); and a clean air flowing unit 41 (42) that allows clean air to flow along the substrate transfer chamber 14 (25).
Public/Granted literature
- US20110103923A1 SUBSTRATE PROCESSING APPARATUS Public/Granted day:2011-05-05
Information query
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