Invention Grant
- Patent Title: Cable assembly having an improved circuit board
- Patent Title (中): 电缆组件具有改进的电路板
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Application No.: US13314468Application Date: 2011-12-08
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Publication No.: US08662917B2Publication Date: 2014-03-04
- Inventor: Chien-Chiung Wang , Xue-Liang Zhang , Qing-Man Zhu , Jian-Jun Zhu
- Applicant: Chien-Chiung Wang , Xue-Liang Zhang , Qing-Man Zhu , Jian-Jun Zhu
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agent Ming Chieh Chang; Wei Te Chung
- Main IPC: H01R12/24
- IPC: H01R12/24

Abstract:
A cable assembly (100) includes a cover (40) defining a cavity (101), a circuit board (20) assembled in the cavity and including a first surface (201) and a second surface (202) lower than the first surface, and a cable (2) having a jacket (22) and a number of wires (21) shrouded by the jacket. Each wire includes an inner coat (210) and a conductor having a free end (211) exposed outwardly from the inner coat for being soldered to the first surface, with the inner coat disposed on the second surface.
Public/Granted literature
- US20120149255A1 CABLE ASSEMBLY HAVING AN IMPROVED CIRCUIT BOARD Public/Granted day:2012-06-14
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