Invention Grant
- Patent Title: Cutting method and cutting device for hard material
- Patent Title (中): 硬质材料的切割方法和切割装置
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Application No.: US12608037Application Date: 2009-10-29
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Publication No.: US08662959B2Publication Date: 2014-03-04
- Inventor: Kunitaka Kuriyama , Masahiko Fukuta , Katsuhiko Sekiya , Yasuo Yamane
- Applicant: Kunitaka Kuriyama , Masahiko Fukuta , Katsuhiko Sekiya , Yasuo Yamane
- Applicant Address: JP Tokyo
- Assignee: Toshiba Kikai Kabushiki Kaisha
- Current Assignee: Toshiba Kikai Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: DLA Piper LLP (US)
- Priority: JP2008-290174 20081112
- Main IPC: B24B1/00
- IPC: B24B1/00
Abstract:
A method of cutting a workpiece made of a highly-hard material is provided. The workpiece is cut by a machining device including a workpiece holder that holds the workpiece, a spindle device that rotates the workpiece holder, a tool holder that holds a tool, and a relative moving mechanism that relatively moves the workpiece holder and the tool holder at least in two axial directions orthogonal to each other. In the machining device, positioning errors in the axial directions are within 5 nm.
Public/Granted literature
- US20100120337A1 CUTTING METHOD AND CUTTING DEVICE FOR HARD MATERIAL Public/Granted day:2010-05-13
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