Invention Grant
US08662961B2 Polishing pad seasoning method, seasoning plate, and semiconductor polishing device 有权
抛光垫调味方法,调味板和半导体抛光装置

Polishing pad seasoning method, seasoning plate, and semiconductor polishing device
Abstract:
A seasoning plate is placed on a polishing pad and performs seasoning of the polishing pad by abrading the polishing pad through the friction caused by rotation of the polishing pad. The seasoning plate includes: conditioners that abrade the polishing pad; a round flexible substrate that has the conditioners attached to the lower face thereof; an O-ring that is placed on the upper face of the flexible substrate, the O-ring forming a circle concentric with the flexible substrate; and a weight plate serving as a weight portion that is placed on the O-ring and applies weight for deforming the flexible substrate.
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