Invention Grant
- Patent Title: Polishing pad seasoning method, seasoning plate, and semiconductor polishing device
- Patent Title (中): 抛光垫调味方法,调味板和半导体抛光装置
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Application No.: US12607259Application Date: 2009-10-28
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Publication No.: US08662961B2Publication Date: 2014-03-04
- Inventor: Daisuke Maruoka , Koudai Moroiwa
- Applicant: Daisuke Maruoka , Koudai Moroiwa
- Applicant Address: JP Nagasaki
- Assignee: Sumco Techxiv Corporation
- Current Assignee: Sumco Techxiv Corporation
- Current Assignee Address: JP Nagasaki
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2008-278683 20081029
- Main IPC: B24B1/00
- IPC: B24B1/00

Abstract:
A seasoning plate is placed on a polishing pad and performs seasoning of the polishing pad by abrading the polishing pad through the friction caused by rotation of the polishing pad. The seasoning plate includes: conditioners that abrade the polishing pad; a round flexible substrate that has the conditioners attached to the lower face thereof; an O-ring that is placed on the upper face of the flexible substrate, the O-ring forming a circle concentric with the flexible substrate; and a weight plate serving as a weight portion that is placed on the O-ring and applies weight for deforming the flexible substrate.
Public/Granted literature
- US20100105295A1 POLISHING PAD SEASONING METHOD, SEASONING PLATE, AND SEMICONDUCTOR POLISHING DEVICE Public/Granted day:2010-04-29
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