Invention Grant
- Patent Title: Hydrogel bone void filler
- Patent Title (中): 水凝胶骨空隙填料
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Application No.: US10987817Application Date: 2004-11-12
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Publication No.: US08663225B2Publication Date: 2014-03-04
- Inventor: Jill M. Embry
- Applicant: Jill M. Embry
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Agency: Sorell Lenna & Schmidt LLP
- Main IPC: A61F2/28
- IPC: A61F2/28

Abstract:
A bone void filler material, including a hydrogel component provided by microparticulates of pre-set hydrogel material dispersed within a carrier component to maintain the microparticulates substantially proximate to one another so that the resulting fill material is rendered as a substantially flowable mass.
Public/Granted literature
- US20060106392A1 Hydrogel bone void filler Public/Granted day:2006-05-18
Information query
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