Invention Grant
- Patent Title: Honeycomb structure
- Patent Title (中): 蜂窝结构
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Application No.: US12968685Application Date: 2010-12-15
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Publication No.: US08663356B2Publication Date: 2014-03-04
- Inventor: Chika Goto , Masataka Yamashita , Yukio Miyairi
- Applicant: Chika Goto , Masataka Yamashita , Yukio Miyairi
- Applicant Address: JP Nagoya
- Assignee: NGK Insulators, Ltd.
- Current Assignee: NGK Insulators, Ltd.
- Current Assignee Address: JP Nagoya
- Agency: Burr & Brown, PLLC
- Priority: JP2010-000690 20100105
- Main IPC: B01D39/14
- IPC: B01D39/14 ; B01D39/06 ; B01D24/00 ; B01D50/00

Abstract:
A honeycomb structure wherein the thickness of each partition wall is 50.8 μm inclusive to 161.5 μm exclusive, the cell density is 15.5 to 62.0 cells/cm2, the cell opening ratio of the honeycomb structure body is 76 to 91%, the porosity of the partition walls is 35 to 45%, the average pore diameter of the partition walls is 2 μm inclusive to 10 μm exclusive, the material for the partition walls includes at least one member selected from the group consisting of cordierite, aluminum titanate, silicon carbide, alumina and mullite, and the value obtained by dividing the average pore diameter of the partition walls by the thickness of the partition walls is larger than 0.04 but smaller than 0.065.
Public/Granted literature
- US20110203242A1 HONEYCOMB STRUCTURE Public/Granted day:2011-08-25
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