Invention Grant
- Patent Title: Heat treatment method and components treated according to the method
- Patent Title (中): 按照该方法处理的热处理方法和组分
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Application No.: US11620897Application Date: 2007-01-08
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Publication No.: US08663404B2Publication Date: 2014-03-04
- Inventor: Ling Yang , Robin Carl Schwant
- Applicant: Ling Yang , Robin Carl Schwant
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: Cantor Colburn LLP
- Main IPC: C22F1/10
- IPC: C22F1/10 ; C21D6/02

Abstract:
Disclosed herein is a method of treating a component comprising solution treating the component for a period of about 4 to about 10 hours at a temperature of about 1750 to about 1850°F.; cooling the component to a temperature of about 1580 to about 1650°F. at an average rate of 1°F./min to about 25°F./min; stabilizing the component at about 1580 to about 1650°F. for a period of about 1 to about 10 hours; cooling the component to room temperature; precipitation aging the component at a first precipitation aging temperature of about 1275 to about 1375°F. for about 3 to about 15 hours; cooling the component at an average rate of 50 to about 150°F./hour to a second precipitation aging temperature of about 1100 to about 1200°F. for a time period of about 2 to about 15 hours; and cooling the component.
Public/Granted literature
- US20080163963A1 Heat Treatment Method and Components Treated According to the Method Public/Granted day:2008-07-10
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