Invention Grant
- Patent Title: Apparatus for processing substrate and method of doing the same
- Patent Title (中): 用于处理衬底的装置及其做法
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Application No.: US13604229Application Date: 2012-09-05
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Publication No.: US08663488B2Publication Date: 2014-03-04
- Inventor: Shusaku Kido
- Applicant: Shusaku Kido
- Applicant Address: WS Apia
- Assignee: Gold Charm Limited
- Current Assignee: Gold Charm Limited
- Current Assignee Address: WS Apia
- Agency: Altis Law Group, Inc.
- Priority: JP2003-326553 20030918; JP2003-375975 20031105; JP2004-230665 20040806
- Main IPC: B44C1/22
- IPC: B44C1/22
Abstract:
A method of processing a substrate through the use of an apparatus, including a substrate carrier for carrying a substrate; a liquid-applying unit for applying chemical to said substrate; and a gas-applying unit for applying gas atmosphere generated by vaporizing the liquid to said substrate. And the apparatus includes a plurality of process units, and the same process is applied to the substrate in each said process units.
Public/Granted literature
- US20120325776A1 APPARATUS FOR PROCESSING SUBSTRATE AND METHOD OF DOING THE SAME Public/Granted day:2012-12-27
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