Invention Grant
- Patent Title: Encapsulated materials and methods for encapsulating materials
- Patent Title (中): 封装材料的封装材料和方法
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Application No.: US13625371Application Date: 2012-09-24
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Publication No.: US08663511B2Publication Date: 2014-03-04
- Inventor: Kyekyoon Kim , Hyungsoo Choi
- Applicant: The Board of Trustees of the University of Illinois
- Applicant Address: US IL Urbana
- Assignee: The Board of Trustees of the University of Illinois
- Current Assignee: The Board of Trustees of the University of Illinois
- Current Assignee Address: US IL Urbana
- Agency: Guntin & Gust, PLC
- Agent Ed Guntin
- Main IPC: A61J3/07
- IPC: A61J3/07 ; B41J2/14 ; A23L1/00

Abstract:
A system that incorporates teachings of the present disclosure may include, for example, a method for applying a force to at least one of an inner stream, an outer stream or both of a combined stream to produce a plurality of capsules, receiving image data, processing the image data, detecting undesirable capsules from the processed image data, applying a bias charge only to the detected undesirable capsules, and segregating the biased undesirable capsules from the unbiased desirable capsules. Additional embodiments are disclosed.
Public/Granted literature
- US20130049240A1 ENCAPSULATED MATERIALS AND METHODS FOR ENCAPSULATING MATERIALS Public/Granted day:2013-02-28
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