Invention Grant
- Patent Title: Injection molding apparatus and method
- Patent Title (中): 注射成型装置及方法
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Application No.: US13474938Application Date: 2012-05-18
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Publication No.: US08663537B2Publication Date: 2014-03-04
- Inventor: Karl K. Stensvad , Stanley Rendon , Paul A. Martinson , Samuel Kidane , Thomas Herdtle
- Applicant: Karl K. Stensvad , Stanley Rendon , Paul A. Martinson , Samuel Kidane , Thomas Herdtle
- Applicant Address: US MN St. Paul
- Assignee: 3M Innovative Properties Company
- Current Assignee: 3M Innovative Properties Company
- Current Assignee Address: US MN St. Paul
- Agent Kenneth B. Wood
- Main IPC: B29C45/73
- IPC: B29C45/73
Abstract:
A heatsink for use in injection molding, with at least one load-bearing path with a rearward segment, wherein at least a portion of at least one non-load-bearing, dynamic heat-transfer zone of the heatsink is laterally offset from the rearward segment of the load-bearing path.
Public/Granted literature
- US20130307189A1 Injection Molding Apparatus and Method Public/Granted day:2013-11-21
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