Invention Grant
- Patent Title: Thermoplastic resin composition and molded product thereof
- Patent Title (中): 热塑性树脂组合物及其成型体
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Application No.: US13380650Application Date: 2010-07-09
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Publication No.: US08663542B2Publication Date: 2014-03-04
- Inventor: Mitsuteru Mutsuda
- Applicant: Mitsuteru Mutsuda
- Applicant Address: JP Tokyo
- Assignee: Daicel-Evonik Ltd.
- Current Assignee: Daicel-Evonik Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2009-162660 20090709
- International Application: PCT/JP2010/061697 WO 20100709
- International Announcement: WO2011/004892 WO 20110113
- Main IPC: H05B6/00
- IPC: H05B6/00

Abstract:
A thermoplastic resin composition of which the molding efficiency can be improved by a high flowability and a high crystallization temperature while ensuring desired physical properties (e.g., strength) in a molded product, and a molded product of the composition are provided.The thermoplastic resin composition comprises a plurality of thermoplastic resins having a melt viscosity different from each other and containing a unit which comprises an arylene group and an ether group and/or a carbonyl group; when the thermoplastic resin composition at least comprises a first thermoplastic resin having a melt viscosity of 150 to 1500 Pa·s at a temperature of 400° C. and a shear rate of 1216 s−1, and a second thermoplastic resin, and the melt viscosity ratio of the first thermoplastic resin relative to the second thermoplastic resin at a temperature of 400° C. and a shear rate of 1216 s−1 [the former/the latter] is 1.5/1 to 10/1.
Public/Granted literature
- US20120100365A1 THERMOPLASTIC RESIN COMPOSITION AND MOLDED PRODUCT THEREOF Public/Granted day:2012-04-26
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