Invention Grant
- Patent Title: Method and apparatus for lapping food dough
- Patent Title (中): 研磨食品面团的方法和设备
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Application No.: US12708727Application Date: 2010-02-19
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Publication No.: US08663726B2Publication Date: 2014-03-04
- Inventor: Takeshi Oderaotoshi , Tomokuni Akutsu , Hiroyuki Okaizumi , Norio Kobayashi
- Applicant: Takeshi Oderaotoshi , Tomokuni Akutsu , Hiroyuki Okaizumi , Norio Kobayashi
- Applicant Address: JP Tochigi
- Assignee: Rheon Automatic Machinery Co., Ltd.
- Current Assignee: Rheon Automatic Machinery Co., Ltd.
- Current Assignee Address: JP Tochigi
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2009-053106 20090306
- Main IPC: A21C3/02
- IPC: A21C3/02

Abstract:
An object is to provide a method and an apparatus for lapping strip-shaped food dough onto a transporting unit without repeatedly applying tension or relaxation. A method of lapping food dough in which strip-shaped food dough being continuously conveyed is lapped onto the transporting unit configured to transport the food dough in a direction intersecting a conveyance direction of the food dough. The method includes the steps of conveying the conveyed food dough 9 to a swing guide member 137 through a swing conveyor 135 swingable in a vertical direction, the swing guide member provided at a tip end of the swing conveyor 135 so as to be swingable in a direction being horizontal and intersecting a transportation direction of the transporting unit 15, and always maintaining an almost constant clearance between a tip end of the swing guide member 137 and a transport surface of the transporting member 15 and thereby maintaining an almost constant length of the food dough 9 from a base end of the swing conveyor 135 to the transport surface of the transporting unit 15.
Public/Granted literature
- US20100227037A1 METHOD AND APPARATUS FOR LAPPING FOOD DOUGH Public/Granted day:2010-09-09
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