Invention Grant
- Patent Title: Bonded and stitched composite structure
- Patent Title (中): 粘合和缝合复合结构
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Application No.: US13458627Application Date: 2012-04-27
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Publication No.: US08663770B2Publication Date: 2014-03-04
- Inventor: Bart F. Zalewski , William B. Dial
- Applicant: Bart F. Zalewski , William B. Dial
- Applicant Address: US OH Middleburg Heights
- Assignee: Zin Technologies, Inc.
- Current Assignee: Zin Technologies, Inc.
- Current Assignee Address: US OH Middleburg Heights
- Agency: Tarolli, Sundheim, Covell & Tummino LLP
- Main IPC: B32B3/10
- IPC: B32B3/10

Abstract:
A method of forming a composite structure can include providing a plurality of composite panels of material, each composite panel having a plurality of holes extending through the panel. An adhesive layer is applied to each composite panel and a adjoining layer is applied over the adhesive layer. The method also includes stitching the composite panels, adhesive layer, and adjoining layer together by passing a length of a flexible connecting element into the plurality of holes in the composite panels of material. At least the adhesive layer is cured to bond the composite panels together and thereby form the composite structure.
Public/Granted literature
- US20120276320A1 BONDED AND STITCHED COMPOSITE STRUCTURE Public/Granted day:2012-11-01
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