A resin composition for laser engraving is provided that includes (Component A) a compound having a hydrolyzable silyl group and/or a silanol group, (Component B) a depolymerization catalyst and/or a depolymerization catalyst precursor, and (Component C) a depolymerizable binder polymer. There are also provided a relief printing plate precursor for laser engraving that includes a relief-forming layer containing the resin composition for laser engraving, a relief printing plate precursor for laser engraving having a crosslinked relief-forming layer formed by crosslinking by means of light and/or heat a relief-forming layer that includes the resin composition for laser engraving, a process for producing a relief printing plate precursor for laser engraving that includes a layer formation step of forming a relief-forming layer from the resin composition for laser engraving and a crosslinking step of crosslinking the relief-forming layer by light and/or heat to thus obtain a relief printing plate precursor having a crosslinked relief-forming layer, a process for making a relief printing plate that includes a layer formation step of forming a relief-forming layer from the resin composition for laser engraving, a crosslinking step of crosslinking the relief-forming layer by light and/or heat to thus obtain a relief printing plate precursor having a crosslinked relief-forming layer, and an engraving step of laser-engraving the relief printing plate precursor having a crosslinked relief-forming layer to thus form a relief layer, and a relief printing plate having a relief layer made by the process for making a relief printing plate.