Invention Grant
- Patent Title: Chip provided with film having hole pattern with the use of thermoresponsive polymer and method of producing the same
- Patent Title (中): 具有使用热电聚合物的具有孔图案的膜的芯片及其制造方法
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Application No.: US13569291Application Date: 2012-08-08
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Publication No.: US08664003B2Publication Date: 2014-03-04
- Inventor: Eiichi Tamiya , Yoshiyuki Yokoyama , Satoshi Fujiki , Katsumi Tanino , Atsushi Muraguchi , Hiroyuki Kishi , Yoshiharu Tokimitsu , Shohei Yamamura
- Applicant: Eiichi Tamiya , Yoshiyuki Yokoyama , Satoshi Fujiki , Katsumi Tanino , Atsushi Muraguchi , Hiroyuki Kishi , Yoshiharu Tokimitsu , Shohei Yamamura
- Applicant Address: JP Toyama JP Tokyo
- Assignee: Toyama Prefecture,Nissan Chemical Industries, Ltd.
- Current Assignee: Toyama Prefecture,Nissan Chemical Industries, Ltd.
- Current Assignee Address: JP Toyama JP Tokyo
- Agency: Oliff PLC
- Priority: JP2005-287634 20050930
- Main IPC: C12Q1/24
- IPC: C12Q1/24

Abstract:
A chip useful for treating cells and the like which has a mechanism and a structure wherein the size of a hole pattern is arbitrarily changed so that cells can easily move in and get out from the hole in scattering or collecting cells but can hardly get out from the hole during washing or antigen-stimulation. The chip comprises a crosslinked product of a temperature-responsive polymer as a constituting member and being provided with a film having a hole pattern on the surface of a baseboard. A method of producing the chip comprises applying a composition containing a crosslinkable temperature-responsive polymer on the surface of a baseboard to thereby form a coating film, crosslinking the coating film to thereby form the crosslinked product as described above and then forming a hole pattern on the coating film of the crosslinked product.
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