Invention Grant
- Patent Title: Exposing connectors in packages through selective treatment
- Patent Title (中): 通过选择性处理将连接器暴露在包装中
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Application No.: US13331061Application Date: 2011-12-20
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Publication No.: US08664040B2Publication Date: 2014-03-04
- Inventor: Chen-Hua Yu , Chung-Shi Liu , Chun-Cheng Lin , Meng-Tse Chen , Ming-Da Cheng
- Applicant: Chen-Hua Yu , Chung-Shi Liu , Chun-Cheng Lin , Meng-Tse Chen , Ming-Da Cheng
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L21/50
Abstract:
A method includes performing an etching step on a package. The package includes a package component, a connector on a top surface of the package component, a die bonded to the top surface of the package component, and a molding material molded over the top surface of the package component. The molding material covers the connector, wherein a portion of the molding material covering the connector is removed by the etching step, and the connector is exposed.
Public/Granted literature
- US20130154086A1 Exposing Connectors in Packages Through Selective Treatment Public/Granted day:2013-06-20
Information query
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